HPL is a dielectric specifically formulated for high power lighting LED
applications with demanding thermal performance requirements. This thin
dielectric at 0.0015" (38μm) has the ability to withstand high
temperatures with a glass transition of 185°C and phenomenal thermal performance
of 0.30°C/W (RD 2018). Bergquist Thermal Clad HPL is available in scored array
circuits, scored singulated circuit, punched singulated parts and in LED
standard stars and squares configurations.
Applications
High
watt-density applications where achieving the lowest
thermal resistance is required
Backlighting
Projectors
LED
applications
Benefits
Very
low thermal impedance 0.02°C-in2/W (0.13°Ccm2/W)
High
thermal conductivity of 3.0 W/m-K
High
temperature applications
Lead-free
solder compatible
RoHS
compliant and environmentally green
Available on all aluminum and copper metal
substrates as
well as Ultra Thin Circuits
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