Dear Planarization Lounge Members,
I wanted to take this opportunity to thank all of you for participating in the second Annual SemiNeedle CMP Technology Assessment Roundtable. In particular, I wanted to thank the esteemed panelists and all other experts who took their time to contribute to these discussions. A special thanks to Ed Korzynski, for a great job done as our moderator. I also wanted to thank our sponsor Ehwa Diamond for their support of this event.
During this process, similar to last year, we received numerous feedback from members who found the event extremely valuable. During the two weeks of the Roundtable, we had 16 members contributing on 17 topics with a total of 146 replies, serving over 5,000 page views.
Attached, Ed has kindly collated the content of the roundtable into a single document, summarizing the key discussions, representing an assessment of the CMP Technology today. Feel free to download and share with colleagues.
Meanwhile, your input is greatly appreciated and is critical in improving how we conduct these sessions in the future. Please use the reply area below to provide your feedback on this year's session as well as suggestions on how to improve future events. You can also contact me directly by sending a me private message.
Best Regards,
Robert Petrossian
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