Manufacturer: Allwin21 Corp.
Condition: New
Wafer Size: 3″ – 6″ Capability
Wafer Loading: 3-axis Robot; Stationary Cassette Plate
Plasma Power: RF 13.56MHz
Type: Parallel/Single Wafer Process; Stand-Alone
Gas Lines: 1-3 Lines
Downloads:
AW-901e Plasma Etch System Key Features:.
- PROCESS AND PRODUCTION PROVEN reactor chamber assembly with upper and lower electrode.
- Handles 75mm,100mm, 125mm, 150mm Silicon or III-V wafers ,round.
- Robotic 3-axis wafer transfer TO PREVENT WAFER BREAKAGE.
- 4 independent gas line with 4 MFCs (Customized)
- Processing of substrate directly on cooled wafer chuck
- 13.56MHz fully automated RF matching network
- ENI ACG-10B 13.56MHz or Equivalent (Water Cooled). Air-Cooled RF Generators are optional.
- Accurate, closed-loop pressure control with UPC and MKS Baratron capacitance manometer
- Touch screen monitor or LCD Monitor with PC.
New AW-901e Control System from Allwin21 Corp.
- Gas flows: settings for up to 4 independent mass flow controller values
- RF power: 50 to 1000 watts
- Process pressure
- Absolute endpoint time
- Timed cycles up to 4 hour each
- Wafer pins up/down
- Optical Endpoint Parameters
- Automated calibration of all subsystems
- Trouble shooting to subassembly levels
- Programmed comprehensive calibration and Built-in diagnostic functions
- Recipe creation for full automatic wafer processing
- Automatic decline of improper recipes and process data
- Multi level pass word protections
- Storage of multiple recipes and system functions
- Real-Time process data acquisition, display ,analysis
- Real-Time graphics display
- Process Data and Recipe storage on a hard drive
Plasma Etcher, Please Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 915
Comments